Component fabrication and in particular fabrication by deposition processes for large components is made more convenient by initially depositing a masking deposition layer (2) upon a thin substrate (1) such that subsequently shaped metal deposition techniques can be used. Previously, the relatively thin nature of the substrate (1) has rendered the hot heat plume (11) of the shaped metal deposition technique too intrusive. It will be understood that this heat plume (11) may distort the thin substrate (1). By initial application of a protective masking deposition layer (2), the underlying substrate is protected by that layer (2) from the heat plume (11) generated by the shaped metal deposition process.
