MAGNETIC ASSIST MANUFACTURING TO REDUCE MOLD FLASH AND ASSIST WITH HEAT SLUG ASSEMBLY

摘要

A method and apparatus (200) for fabricating a semiconductor package, wherein a heat spreader (118) is placed in a mold cavity (204) of a mold, and a leadframe (108) is placed over the heat spreader. A magnetic field (218) is applied to the mold cavity, wherein one or more of the heat spreader and leadframe are generally attracted to a surface (212) of the mold cavity, thus generally determining a position (214) of the heat spreader within the mold cavity and defining a contact region (120) between the heat spreader and the mold. An encapsulation material is further injected into the mold cavity, wherein the encapsulation material is generally prevented from entering the contact region due, at least in part, to the applied magnetic field. The encapsulation material is then cured, and the semiconductor package is removed from the mold cavity.