Erzeugung von mechanischen und elektrischen Verbindungen zwischen den Oberflächen zweier Substrate

摘要

Forming a mechanical and electrical connection between two substrates (10) comprises preparing substrates with a metallic layer (16) and a layer of amorphous semiconductor material (18), joining the semiconductor material layers and heating the metallic layers and the semiconductor material layers so that diffusion between the layers occurs to form an alloy. Preferred Features: The metallic layer is made from aluminum and the amorphous semiconductor material layer is made from silicon. Joining of the layers takes place at 350 [deg] C. The substrates are chips and/or wafers.