| 摘要 |
A method ( 300 ) and apparatus ( 200 ) for fabricating a semiconductor package ( 100 ), wherein a heat spreader ( 118 ) is placed in a mold cavity ( 204 ) of a mold ( 202 ), and a leadframe ( 108 ) is placed over the heat spreader ( 118 ). A magnetic field ( 218 ) is applied to the mold cavity ( 204 ), wherein one or more of the heat spreader ( 118 ) and leadframe ( 108 ) are generally attracted to a surface ( 212 ) of the mold cavity ( 204 ), thus generally determining a position ( 214 ) of the heat spreader ( 118 ) within the mold cavity ( 204 ) and defining a contact region ( 120 ) between the heat spreader ( 118 ) and the mold ( 202 ). An encapsulation material ( 114 ) is further injected into the mold cavity ( 204 ), wherein the encapsulation material ( 114 ) is generally prevented from entering the contact region ( 120 ) due, at least in part, to the applied magnetic field ( 218 ). The encapsulation material ( 114 ) is then cured, and the semiconductor package ( 100 ) is removed from the mold cavity ( 204 ). |
