摘要 |
<p>A photomask (100), method of designing, of fabricating, of designing, a method of inspecting and a system for designing the photomask (100). The photomask (100), includes: a cell region (110), the cell region (110) comprising one or more chip regions (155 A, 155B, 155C, 155D), each chip region (155 A, 155B, 155C, 155D) comprising a pattern of opaque and clear sub-regions corresponding to features of an integrated circuit chip and one or more kerf regions (160A, 160B, 160C, 160D), each kerf region (160A, 160B, 160C, 160D) comprising a pattern of opaque and clear sub-regions corresponding to features of an integrated circuit kerf; a clear region (125A) formed adjacent to a side of a copy region (170A, 170B), the copy region (170A, 170B) comprising opaque and clear sub-regions that are copies of at least a part of the cell region (110); and an opaque region (115) between the clear region (125A, 125B, 125C, 125D) and the cell region (110).</p> |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;RANKIN, JED, H.;WATTS, ANDREW, J. |
发明人 |
RANKIN, JED, H.;WATTS, ANDREW, J. |