| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact semiconductor device which is, in particular, a semiconductor device such as a power module or the like provided with a plurality of semiconductor elements. SOLUTION: A first bonding wire 10 and a second bonding wire 11 are directly connected between first electrodes 8 and second electrodes 9 of a plurality of semiconductor elements 2, respectively. Only one end of the first bonding wire 10 and one end of the second bonding wire 11 are connected to an internal electrode 5 of a first control terminal 4 and an internal electrode 7 of a second control terminal 6, respectively. Accordingly, the internal electrodes 5, 7 having a small area can be used, thus accomplishing a miniaturization of a semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT |
