| 摘要 |
A method of forming a dielectric substrate comprises contacting a liquid crystalline polymer fibrous web having a thickness of 5 mils (127 micrometers) or less with a resin composition to form a dielectric composite. Contacting is carried out under vacuum, followed by pressure. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent dielectric strength.
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