SURFACE ACOUSTIC WAVE DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A surface acoustic wave device package and a method for manufacturing the same are provided to prevent moisture from being infiltrated into an airtight space by protecting the SAW device package through a ring-shape metal plated layer and a metal shield layer. In a surface acoustic wave device package(100), a via substructure is formed inside a multi-layer wiring substrate(101). A SAW(Surface Acoustic Wave) chip(107) is bonded at a surface of the multi-layer wiring substrate(101) as a flip chip type. A ring-shape metal plated layer(104) is formed at the surface of the multi-layer wiring substrate(101), along an outline of the SAW chip(107). A protective film(106) forms an airtight space by surrounding the SAW chip(107). A metal shield layer(116) formed at a surface of the protective film(106) is connected with the ring-shape metal plated layer(104).