SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

A semiconductor device is provided with a semiconductor substrate; a circuit element formed on the semiconductor substrate; a multilayer wiring structure formed on the semiconductor substrate in a status where the structure is electrically connected with the circuit element; and a metal wall formed outside the multilayer wiring structure to surround the multilayer wiring structure. An uppermost layer of the metal wall is composed of a metal having aluminum as a main component, and the metal is embedded in a groove-shaped contact hole continuously extending over the outer circumference of the semiconductor substrate and is electrically connected with a lower layer metal wall.