| 摘要 |
A PCB and a manufacturing method thereof are provided to increase a density of IVHs(Inner Via Holes) formed on the core unit by using a thin glass substrate as a core unit. A PCB(Printed Circuit Board) includes a core unit, a first plating layer(20), and a second plating layer(22). The core unit includes a glass substrate, on which a via-hole is formed. The first plating layer is formed on a surface of the core unit corresponding to a circuit pattern. The second plating layer is formed on a region, where the first plating layer is formed. A thickness of the glass substrate lies between 0.1 and 0.3mm. The via-hole is filled with a conductive paste, plug-in ink, or the second plating layer.
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