发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a pattern of a uniform line width regardless of illuminance variation of a semiconductor laser light source, suitable for direct exposure with a semiconductor diode laser in the region of 350-410 nm, developable with an alkaline aqueous solution, and excellent in sensitivity, resolution, adhesion to a substrate and storage stability. <P>SOLUTION: The photosensitive resin composition contains (a) an imidazole dimer photoinitiator, (b) a triarylmethane photosensitizer and (c) a hetero-aromatic photosensitizer containing a thiol functional group. The photosensitive resin composition can be used in a process of producing the LCD of a mobile-phone, a notebook computer, a monitor, TV or the like and can be used in production of any LCD such as a transmissive, reflective or semi-transparent LCD irrespectively of a system such as a TFT or STN system. The photosensitive resin composition can be used in all of semiconductor processes as well as in the production of the liquid crystal display. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313347(A) 申请公布日期 2006.11.16
申请号 JP20060127188 申请日期 2006.05.01
申请人 DONGJIN SEMICHEM CO LTD 发明人 PARK CHAN-SEOK;KIM BONG-GI
分类号 G03F7/031;C08F2/50;G03F7/004;G03F7/027;G03F7/033 主分类号 G03F7/031
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