| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device formed by a technique in which a plurality of package units are formed to a single circuit board, sealed collectively with a resin and divided into fragments, without deteriorating a productivity; and to prevent a laminating peeling, an interface peeling, a crack, and the infiltration of a moisture from the side face of the board by a working load in the case of a cutting. <P>SOLUTION: Slits along the peripheral direction of package unit regions are formed in each package unit region of the circuit board before a division as the circuit boards 1A of the semiconductor devices as the fragments. Metallic materials are embedded into the slits, metallic barriers 19 are formed, and the circuit boards with the metallic barriers 19 and the sealing resin are cut at every package unit. The side faces of the boards can be protected by the metallic barriers 19. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
