| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition using neither halogenated compound nor phosphorus compound, having excellent flame retardance and capable of expressing properties of high heat resistance and low thermal expansion, to provide a prepreg, and to provide a copper-clad laminate. SOLUTION: The resin composition comprises, as essential ingredients, a heat curable resin giving cured products having 10-80 ppm linear expansion coefficient at temperatures of from -65°C to 220°C, and an inorganic filler. COPYRIGHT: (C)2007,JPO&INPIT
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