发明名称 |
Multi stack packaging chip and method of manufacturing the same |
摘要 |
A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; forming a solder on the second wafer; and combining the second wafer with the first wafer so that the second circuit element and the cavity correspond. The chip includes a flip-chip packaged chip in which a first circuit element is packaged using a first wafer; a second circuit element formed on the first wafer; a second wafer having a cavity and combined with the first wafer so that the cavity and the second circuit element correspond; a third circuit element formed on the second wafer; and a solder formed on the second wafer, the solder electrically coupling the second wafer to a packaging substrate.
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申请公布号 |
US2006255443(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20060391211 |
申请日期 |
2006.03.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG JUN-SIK;KIM WOON-BAE;MOON CHANG-YOUL;LEE MOON-CHUL;JUNG KYU-DONG |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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