发明名称 |
Technique for defining a wettable solder joint area for an electronic assembly substrate |
摘要 |
A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate is provided that includes at least one conductive trace. A nickel layer is provided on the conductive trace and gold is selectively applied on the nickel layer in a desired pattern to form a gold layer. An exposed portion of the nickel layer that does not include the gold in the desired pattern is then oxidized. Finally, a solder is applied to the gold layer, with the oxidized nickel layer providing a solder stop and defining a wettable solder joint area.
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申请公布号 |
US2006255102(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20050126604 |
申请日期 |
2005.05.11 |
申请人 |
SNYDER RICK B;DELHEIMER CHARLES I;OMAN TODD P;FAIRCHILD M R |
发明人 |
SNYDER RICK B.;DELHEIMER CHARLES I.;OMAN TODD P.;FAIRCHILD M. R. |
分类号 |
B23K1/20;B23K31/00 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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