| 摘要 |
The invention relates to a method for producing a chip panel or composite wafer by means of a heating and pressing process, and also to a device for carrying out the method. For carrying out the method, a chip carrier sheet and a transfer sheet are provided in the device. The method comprises loading the chip carrier sheet with semiconductor chips and heating the sheets. As this happens, one of the sheets remains dimensionally stable, while the semiconductor chips are pressed into the other, deformable sheet.
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