Light transmitting unit module for back lighting of liquid crystal display surface, has semiconductor chip which is mounted on carrier, where lens surrounds semiconductor chip with less height directly without additional housing

摘要

A module has a semiconductor chip (6) mounted on a carrier, which is formed by a metal core plate. The thickness of the carrier is 1.2-1.4 mm. The chip is connected with the substrate in a firmly-bonded manner. A lens (9) surrounds the semiconductor chip with less height directly without an additional housing. The carrier is provided with a flaring for accommodating the chip.