| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is capable of ensuring an elastic modulus of an underfill resin at an upper limit of temperature at which a performance assurance is required, and reducing an internal stress imposed on a semiconductor chip when a temperature is dropped after the underfill resin is hardened. SOLUTION: The semiconductor device manufacturing method comprises a first process of connecting a semiconductor chip on a circuit board through bumps in a flip chip mounting manner, a second process of providing the underfill resin between the circuit board and the semiconductor chip, and a third process of hardening the underfill resin through a thermal treatment. Provided that the upper limit of temperature of resin at which a performance assurance is required is represented by T, resin having a glass transition temperature of T-25°C to T-5°C is used as the underfill resin, and a thermal treatment is carried out at temperatures of T-10°C to T+10°C. COPYRIGHT: (C)2007,JPO&INPIT |
