发明名称 SYSTEM FOR EVALUATING SOLDERED JOINT SECTION
摘要 PROBLEM TO BE SOLVED: To more rapidly predict the life of soldered joint sections. SOLUTION: This system comprises a data storage part 11; an input control part 12; and a soldered joint evaluation part 13. A mathematical formula indicating the relation between values of factors related to the life of soldered joint sections and the life of the soldered joint sections in the case that repetitive loads due to temperature changes are exerted is previously stored in a design rule database 11 in a data storage part 11. In the system, the input control part 12 receives values of factors input via an input device 3 and related to the life of a soldered joint part to be examined connecting between an electronic part and a wiring board, between two electronic parts, or two boards. Then the soldered joint evaluation part 13 predicts the life of the soldered joint part to be examined connecting between the electronic part and the wiring board, between the two electronic parts, or the two boards on the basis of the mathematical formula and the values of the factors input by a user. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006313127(A) 申请公布日期 2006.11.16
申请号 JP20050136458 申请日期 2005.05.09
申请人 HITACHI LTD 发明人 FUJIWARA SHINICHI;YOKOZUKA TAKEHIDE;HARADA MASAHIDE;YAMASHITA SHIRO
分类号 G01N19/04;G01N3/00;G01N3/32;H05K3/34 主分类号 G01N19/04
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