| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an extremely thin copper foil with a carrier used at the time of production of a printed wiring board for use in a fine pattern, not scattering a laser absorbing layer or extremely thin copper to the peripheral part of a viahole or not forming the build-up of copper when laser perforating processing is performed in order to form the viahole to a build-up wiring board and extremely easy in wiring processing, the printed wiring board using it and a multilayered printed wiring board. <P>SOLUTION: In the extremely thin copper foil with the carrier, a peel ply and the extremely thin copper foil are formed on one side of the carrier in this order and a layer easy to absorb the beam with a wavelength oscillated by a CO<SB>2</SB>gas laser is formed on the other surface of the carrier. The layer easy to absorb the beam with the wavelength oscillated to by CO<SB>2</SB>gas laser comprises a layer containing at least one kind of an element selected from the group consisting of nickel, cobalt, iron, zinc, manganese, chromium, tin and phosphorus. The printed wiring board and the multilayered printed wiring board are manufactured using this extremely thin copper foil with the carrier. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
