| 摘要 |
An improvement on a contact terminal structure to be disposed into the terminal block on the base of an integrated circuit, comprises a main body, a soldering end extending vertically from one end of said main body and providing with an aligning portion of an arcuate hollow shape for placing a solder ball, a supporting portion extending vertically from said main body and being used for supporting said solder ball, and a contact end extending vertically from another end of said main body and providing contortedly with a corresponding contact portion at an appropriate position thereon. This structure can allow said solder ball bond more precisely with said soldering portion on said contact terminal.
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