<p>A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.</p>
申请公布号
WO2006121489(A2)
申请公布日期
2006.11.16
申请号
WO2006US07193
申请日期
2006.02.28
申请人
STAKTEK GROUP L.P.;CADY, JAMES, W.;WEHRLY, JAMES, DOUGLAS, JR.;GOODWIN, PAUL
发明人
CADY, JAMES, W.;WEHRLY, JAMES, DOUGLAS, JR.;GOODWIN, PAUL