| 摘要 |
Resin formulations for sheet molding compounds include low-density thermosetting sheet molding compounds (SMC) comprising an organic-modified, inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, but no calcium carbonate. Reactive monomers include aromatic, multiethylenically-unsaturated compounds that aid thermosetting SMC in yielding exterior and structural thermoset articles, e. g. auto parts, panels, that have Class A Surface Quality. Sheet molding paste formulations include a thermosetting resin, an ethylenically unsaturated monomer, an alternative reactive monomer, a low profiling additive, and a nanoclay filler composition, wherein the SMC has a density less than about 1.25 g/cm.sup.3. A reinforcing roving can be included.
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