| 摘要 |
<p>On the peripheral edge of a front side substrate (11) of an FED, a rectangular frame shaped sealing surface (11a) is formed for sealing a sidewall. On the sealing surface (11a), an indium layer (32) is formed through a base layer (31). At the four corners of the indium layer (32), an electrode (34) for applying an electric current is connected. The indium layer (32) is formed to have a width gradually decreasing from substantially the center of each side of the sealing surface (11a) to adjacent corners.</p> |
