发明名称 IMPROVED METHOD OF FORMING OPENINGS IN AN ORGANIC RESIN MATERIAL
摘要 A thin film of organic resin material (17), such as novolac, is used as an etch mask and openings (32) are formed in the mask in a predetermined pattern to allow processing in selected areas defined by the openings. The openings (32) are formed by applying a pattern of droplets (76) of caustic etchant, such as sodium hydroxide (NaOH) or potassium hydroxide (KOH) in the areas where the openings are to be formed. The droplets (76) are applied using a inkjet printer (90) which is scanned over the surface of the organic resin as the droplets are applied. The droplets (76) are of a size which defines the dimension of the openings (32) and allows the organic resin (17) under the droplet (76) to be completely removed. After the etchant has etched through the organic resin to expose an underlying surface (12), the etchant is washed from the organic resin and the openings (32).
申请公布号 EP1665346(A4) 申请公布日期 2006.11.15
申请号 EP20040761255 申请日期 2004.09.09
申请人 CSG SOLAR AG 发明人 YOUNG, TREVOR, LINDSAY;LASSWELL, PATRICK
分类号 H01L21/027;B41J2/01;H01L21/311;H01L27/142 主分类号 H01L21/027
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