DIE ENCAPSULATION USING A POROUS CARRIER

摘要

A process for encapsulating an integrated circuit die ( 403 ) using a porous carrier ( 101 ). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure ( 505 ). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.