LAMINATE FOR PRINTED CIRCUIT BOARD AND PREPARING METHOD THEREOF

摘要

A resin laminate for a printed circuit board and a preparing method thereof are provided to be applied to a high frequency and a substrate for semiconductor package requiring high reliability. In a resin laminate for a printed circuit board(40), a woven fabric or a non-woven fabric made of a liquid polyester fiber is immersed in a liquid polyester resin, wherein a melting point of the liquid polyester resin is in the range of 280 to 360 degrees centigrade and a permittivity of the liquid polyester fiber is in the range of 2.5 to 3.0 and a melting point of the liquid polyester fiber is in the range of 260 to 350 degrees centigrade.