发明名称 Die carrier for a MEMS with a fluid chamber
摘要 <p>A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.</p>
申请公布号 EP1510500(A3) 申请公布日期 2006.11.15
申请号 EP20040255119 申请日期 2004.08.25
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 HELLEKSON, RONALD A.;CHEN, CHIEN-HUA;BOUCHER, WILLIAM R.;SMITH, JOSHUA W.;CRAIG, DAVID M.;WATTS, GARY J.
分类号 B81B7/00;B81B7/02;B81C1/00;B81C99/00;H01L23/473 主分类号 B81B7/00
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