<p>A die carrier 2 has a body 29 with a primary surface 295 adapted for attachment to a substrate die 31. The body 29 at least partially defines a fluid chamber 23. A fill port 21 and an evacuate port are each fluidically connected to the fluid chamber 23.</p>
申请公布号
EP1510500(A3)
申请公布日期
2006.11.15
申请号
EP20040255119
申请日期
2004.08.25
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
HELLEKSON, RONALD A.;CHEN, CHIEN-HUA;BOUCHER, WILLIAM R.;SMITH, JOSHUA W.;CRAIG, DAVID M.;WATTS, GARY J.