MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT
摘要
A manufacturing method of a PCB(Printed Circuit Board) with embedded electronic components is provided to detect defects at an early stage by performing a defect detecting process after mounting the electronic components. A manufacturing method of a PCB with embedded electronic components(320) includes the steps of: a first step of mounting the electronic component(320) on one side of a first metal film(310a); a second step of aligning in order of stacked material and a second metal film on one side where the electronic component(320) of the first metal film(310a) is mounted; a third step of forming a core layer by pressing the first metal film(310a), stacking material, and second metal film; and forming a circuit pattern on the first metal film(310a) and the second metal film.
申请公布号
KR20060116515(A)
申请公布日期
2006.11.15
申请号
KR20050038949
申请日期
2005.05.10
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, DOO HWAN;RYU, CHANG SUP;CHO, HAN SEO;MIN, BYOUNG YOUL