| 摘要 |
A semiconductor workpiece processing system comprising at least one processing tool, a container, a first transport section, and a second transport section. The processing tool is used for processing semiconductor workpieces. The container is used for holding at least one semiconductor workpiece therein for transporting to and from the processing tool. The first transport section is connected to the processing tool for transporting the container to and from the processing tool. The second transport section is connected to the first transport section for transporting the container to and from the processing tool. The first transport section is vehicle based having a transport vehicle capable of holding the container and moving along a first track of the first transport section. The second transport section is not vehicle based and has a second track with at least one support element thereon adapted to interface with the container for movably supporting the container from the second track and allowing the container to move relative to the first track. The first track and second track are disposed proximate to each other to allow the container to moved therebetween in one move. |
