| 摘要 |
A packaging structure of a silicon condenser microphone and a method for manufacturing the same are provided to reduce loss of products according to a temperature increase of processes by making a substrate of a ceramic element having a similar thermal expansion coefficient with a silicon condenser microphone and a circuit unit. A packaging structure of a silicon condenser microphone includes a substrate(160) and a case(200). A silicon condenser microphone(120) and a circuit unit(140) are installed on an upper plane of the substrate(160). A space for a back chamber is formed inside the substrate(160). An air hole is formed between the space for the back chamber and the upper plane of the substrate(160) in which the silicon condenser microphone(120) is put. The case(200) covers the silicon condenser microphone(120) and the circuit unit(140) on the substrate(160) for protecting the silicon condenser microphone(120) and the circuit unit(140).
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