发明名称 WAFER COOLING STATION OF THERMAL PROCESSING EQUIPMENT
摘要 A wafer cooling station of heat treatment equipment is provided to prevent the damage of a wafer due to the impact between the wafer and an inner wall of the wafer cooling station by detecting previously the deviation of the wafer using a wafer detecting sensor. A wafer cooling station of heat treatment equipment comprises a body(110) with a first cooling water circulating path, a cooling water inlet port(140) connected to an upper portion of the body, a cooling water outlet port(150) connected to a lower portion of the body, a plurality of wafer stages(120) with a second cooling water circulating path corresponding to the first cooling water circulating path, a plurality of wafer support pins for supporting a wafer on the wafer stage, a cover(130) for covering the body, and a wafer detecting sensor. The wafer detecting sensor is used for detecting the deviation of the wafer.
申请公布号 KR20060116396(A) 申请公布日期 2006.11.15
申请号 KR20050038619 申请日期 2005.05.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SUNG JUN
分类号 H01L21/324;H01L21/02 主分类号 H01L21/324
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