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经营范围
发明名称
Semiconductoo Waper Abrasive Apparatus Having A Elaotic Pad
摘要
申请公布号
KR100646451(B1)
申请公布日期
2006.11.14
申请号
KR20050037745
申请日期
2005.05.04
申请人
发明人
分类号
H01L21/304
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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