发明名称 Device and method for fabricating lead frame by press forming
摘要 A device for fabricating a lead frame, by press forming, provided with a die having a flat face, on which a lead frame to be fabricated by press forming is to be placed, and a concavity, which is dented relative to the flat face, the die possessing a fabricating face extending from the bottom of the concavity to the flat face through a slant, which is interposed between the bottom of the concavity and the flat face, the fabricating face contributing the fabrication of a lead frame by press forming, and a punch having punching faces formed so as to be opposite to the fabricating faces of the die for the fabrication of the lead frame by press forming, at least one of the die and the punch being movable so as to hold the lead frame between the fabricating face of the die and the punching face of the punch for the fabrication of the lead frame by press forming, wherein the bottom of the concavity of the die has a bottom concavity formed therein, which is dented relative to the bottom, and the punch has a front end opposite to the bottom of the concavity of the die, the front end being formed so as to have a portion partially spreading over the bottom concavity. A method for fabricating a lead frame by press forming using such a device and a resultant lead frame are also disclosed.
申请公布号 US7134311(B2) 申请公布日期 2006.11.14
申请号 US20040799601 申请日期 2004.03.15
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 IWABUCHI MASAHIRO
分类号 B21F45/00;H01L23/50;H01L21/48 主分类号 B21F45/00
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