发明名称 LIGHT EMITTING DIODE PACKAGE AND BACK LIGHT UNIT USING IT
摘要 An LED package and a backlight unit using the same are provided to improve a cooling efficiency of the LED package itself by using a metallic housing made of copper. An LED package comprises a metallic housing, a metallic lead, and an insulating member. The metallic housing(30) includes an inner space for loading an LED and a hole structure for connecting the inner space with the outside. The metallic lead(50) is inserted into the hole structure of metallic housing. The insulating member(51) is filled in the hole structure to insulate the metallic lead from the metallic housing. The metallic housing is made of one selected from a group consisting of pure copper and copper alloy.
申请公布号 KR20060115954(A) 申请公布日期 2006.11.13
申请号 KR20050054047 申请日期 2005.06.22
申请人 ARRO CO., LTD. 发明人 LEE, SEUNG ICK;YOO, MYOUNG KI
分类号 H01L33/64 主分类号 H01L33/64
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