发明名称 SOCKET FOR REMOVABLY MOUNTING ELECTRONIC PARTS HAVING A PLURALITY OF CONDUCTIVE TERMINALS SUCH AS BGA PACKAGES
摘要 <p>A socket having a base (2) which can removably mount a BGA package (9) and a plurality of contact members (6) which are arranged in conformity with the pattern of terminal solder balls (11) of BGA package (9) on base (2) and which have a pair of arms (6a) and (6b) that are capable of opening or closing for pressure contact in the state of sandwiching each terminal of BGA package (9). Partition walls (4a) are provided on slider (4) which is capable of moving in a direction normal to the opening and closing direction of arms (6a) and (6b), the partition walls engage with the pairs of arms of the contact maker (6) respectively, with the arms (6a) and (6b) being opened or closed by the movement of the partition wall.</p>
申请公布号 KR100642094(B1) 申请公布日期 2006.11.10
申请号 KR20000049626 申请日期 2000.08.25
申请人 发明人
分类号 H01R33/76;G01R31/26;H01L23/32;H01R13/193;H05K7/10 主分类号 H01R33/76
代理机构 代理人
主权项
地址