发明名称 PRINTING BOARD INSPECTION APPARATUS
摘要 <p>An inspection apparatus for a printed circuit board is provided, which overlaps and displays an outline data of the designed printed solder amount and the measured appearance image data and distinguishably displays "where the printed solder is located," "which test has been passed," and "whether the test is passed or failed," to facilitate a failure examination, such as false determination results. According to the measured data, an evaluation object data generating section 3b generates a plurality of evaluation object data indicating the printed solder amount, and a determination device 4 determines a quality of the evaluation object data according to a set tolerance value. On the other hand, according to the measured data, a three-dimensional image data generating device 7 generates three-dimensional appearance image data of the printed solder. When the determination device yields a negative result, each of the failed evaluation objects is marked with different colors to display its designed image data, and these appearance image data and designed image data are overlapped and displayed by the display device 8.</p>
申请公布号 KR100644024(B1) 申请公布日期 2006.11.10
申请号 KR20050026686 申请日期 2005.03.30
申请人 发明人
分类号 G01B11/24;G01N21/956;G01R31/00;G01R31/28;G06T1/00;G06T19/00;H05K3/34 主分类号 G01B11/24
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