| 摘要 |
An object of the present invention is to provide a pressure sensitive adhesive sheet that does not adhere to other apparatuses and the like, even when it is applied to a manufacturing including heat treatment or treatment involving heat generation. It is a further object of the present invention to provide a pressure sensitive adhesive sheet for semiconductor wafer processing or the like having unprecedented high-temperature heat resistance, which can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as protective function of a circuit surface or expanding properties. A pressure sensitive adhesive sheet according to the present invention is characterized by comprising a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material. |
