| 摘要 |
FIELD: electrical engineering, acoustoelectronics, high-frequency quartz resonators, and monolithic quartz filters. ^ SUBSTANCE: proposed method includes mechanical treatment of quartz plates, their covering with shielding coat, and deep chemical etching; mechanical treatment of quartz plates is followed by chemical polishing in slow hydrofluoric acid based etching solution and mechanical polishing; evaporation of shielding coat is followed by alkali etching of quartz crystal part in the form of inverted MESA-structure; then operation of shielding coat evaporation for protecting work region of inverted mesa-structure against impact of fast etching solution is repeated in the course of dividing blank into crystal parts of inverted mesa-structure; after that quartz crystal parts are finished to attain desired purity by deep chemical etching in hydrofluoric acid. ^ EFFECT: facilitates manufacture, reduced thickness spread in work region. ^ 1 cl, 2 dwg |
