| 摘要 |
A liquid injecting apparatus for fabricating a semiconductor device and an LCD is provided to improve uniformity of a liquid material like chemicals by dividing the liquid material and uniformly injecting the divided liquid material to an injection target material like a polishing pad, a wafer, glass and the like. A vibrator(110) is installed over a target material wherein a flow path(111) is formed even in the lower part of the vibrator. A liquid material supplying part(120) supplies a liquid material to the flow path of the vibrator. An attach part(130) is formed in the lower end of the vibrator so that the attach part has a surface to which the liquid material flowing downward along the flow path by the liquid material supply part is attached by viscosity. A vibration generating unit(140) is installed in the vibrator to apply vibration so that the liquid material attached to the attach part is divided into micro particles by energy caused by vibration to be injected toward the target material. At least one distribution supply path is branched from a transfer path of the liquid material supplied to the lower part of the attach part and is extended even to the lower part of the attach part so that the liquid material is supplied to a plurality of positions in the lower part of the attach part. The attach part is made of a cone type wherein the liquid material is attached to the outer surface of the attach part.
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