LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING CONDUCTIVE VIA AND METHOD FOR MANUFACTURING THE SAME

摘要

A low temperature co-fired ceramic substrate having a conductive via and a manufacturing method thereof are provided to reduce a size and a thickness of an RF(Radio Frequency) component by preventing the conductive via from being erroneously coupled with a conductive pattern. A low temperature co-fired ceramic substrate includes first to third conductive patterns. The first and second conductive patterns(21,22) are formed on different layers of plural dielectric layers. The first conductive pattern is vertically connected to the second conductive pattern by a conductive via(24). The third conductive pattern(23) is insulated from the first and second conductive patterns by the dielectric layer. A cavity is formed on a region of the third conductive pattern corresponding to the conductive via. The size of cavity is greater than the conductive via.