发明名称 PROCEDE DE FABRICATION D'UN EMBALLAGE PAR FORMAGE ET FIXATION D'UN FLAN EN MATIERE SEMI-RIGIDE
摘要 The invention relates to a method of producing a package by forming and fixing a semi-rigid blank. The inventive method consists in: cutting perforated lines (E1 to E5) into a substrate (PC) at pre-determined points; fixing a strip of heatweldable film to the substrate in the areas comprising said lines (E1 to E5) at least; cutting a blank from the support/film assembly, such that the cut for said lines (E1 to E5) enables parts of the film to project out; folding the blank and fixing at least two parts thereof by thermoforming at least one projecting part.
申请公布号 FR2843910(B1) 申请公布日期 2006.11.10
申请号 FR20020011017 申请日期 2002.09.03
申请人 S.C.E.B.B (SOCIETE CIVILE D'EXPLOITATION DES BREVETS BODET) 发明人 BODET JEAN
分类号 B31B7/26;B31B15/00;B65D5/02;B65D5/12;B65D5/42;B65D5/56 主分类号 B31B7/26
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