发明名称 |
PROCEDE DE FABRICATION D'UN EMBALLAGE PAR FORMAGE ET FIXATION D'UN FLAN EN MATIERE SEMI-RIGIDE |
摘要 |
The invention relates to a method of producing a package by forming and fixing a semi-rigid blank. The inventive method consists in: cutting perforated lines (E1 to E5) into a substrate (PC) at pre-determined points; fixing a strip of heatweldable film to the substrate in the areas comprising said lines (E1 to E5) at least; cutting a blank from the support/film assembly, such that the cut for said lines (E1 to E5) enables parts of the film to project out; folding the blank and fixing at least two parts thereof by thermoforming at least one projecting part. |
申请公布号 |
FR2843910(B1) |
申请公布日期 |
2006.11.10 |
申请号 |
FR20020011017 |
申请日期 |
2002.09.03 |
申请人 |
S.C.E.B.B (SOCIETE CIVILE D'EXPLOITATION DES BREVETS BODET) |
发明人 |
BODET JEAN |
分类号 |
B31B7/26;B31B15/00;B65D5/02;B65D5/12;B65D5/42;B65D5/56 |
主分类号 |
B31B7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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