| 摘要 |
A semiconductor manufacturing heating chuck is provided to heat quickly uniformly a substrate and to improve efficiency of a substrate treating process by using a heat transfer gas supplying structure. A semiconductor manufacturing heating chuck includes a heating plate(31) with a protruded edge, a support unit(32) for supporting the heating plate, a heat transfer gas storing unit(36) for storing heat transfer gas, a clamp(37) for preventing the deviation of a substrate at an edge portion of the heating plate, a plurality of gas spraying holes for spraying the heat transfer gas along a sidewall of the edge portion of the heating plate, a gas supply path connected with the plurality of gas spraying holes in the edge portion of the heating plate, a gas inlet path for supplying the heat transfer gas to the gas supply path, a gas absorbing hole at an upper center portion of the heating plate, and a gas exhaust path for exhausting the heat transfer gas to the outside.
|
