首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Method for forming metal wiring for semiconductor device and semiconductor device therefore
摘要
申请公布号
KR100645225(B1)
申请公布日期
2006.11.10
申请号
KR20040111571
申请日期
2004.12.23
申请人
发明人
分类号
H01L21/3205
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
您可能感兴趣的专利
LAMINATED METAL GASKET
PROTECTION CIRCUIT OF MOS GATE
ROLLER APPARATUS FOR CONVEYING ARTICLE
IMAGE RETRIEVING DEVICE
PHOTOGRAPHIC DEVICE
MESSAGE EXCHANGING EQUIPMENT BETWEEN SUPERVISOR AND SPECIFIED CALLER
SEMICONDUCTOR INTEGRATED CIRCUIT
ROTARY TYPE CLOSED COMPRESSOR
FUEL INJECTION QUANTITY CONTROL DEVICE OF DIESEL ENGINE WITH SUPERCHARGER
钢液的真空精炼装置
DECONTAMINATOR FOR RADIOACTIVE CONTAMINANT
PLASMA CUTTER
METHOD OF SHIELDING CONSTRUCTION
SLIDE JIG FOR SLIDE DOOR
CONSTRUCTION OF TEST COURSE FOR VEHICLE
HIGH PERFORMANCE TWO-COMPONENT EPOXY STRUCTURAL ADHESIVE
GARBAGE DISPOSAL MACHINE
Catalyst for the manufacture of synthesis gas or hydrogen, and process for its preparation.
笔
APPARATUS AND METHOD FOR DEBOSSING AND SELECTIVELY APERTURING A RESILIENT PLASTIC WEB