| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a double-sided flexible substrate having sufficient thermal resistance, fire retardancy and adhesive property while simple in the manufacturing process without requiring any complex facility. SOLUTION: The manufacturing method of double-sided flexible printed circuit board comprises a process for directly applying varnish containing aromatic polyamide resin shown by the formula (1), epoxy resin and organic solvent, on a metal foil; a process for removing the solvent and providing a resin layer; and a process for bonding the metal foil on the side of the resin layer and curing the same. In the formula, m and n are average values and m+n is the positive integer of 2-200 while n is a positive integer higher than 0.1. Ar<SP>1</SP>, Ar<SP>3</SP>are bivalent aromatic series group and Ar<SP>2</SP>is bivalent aromatic residue having phenolic hydroxyl group. COPYRIGHT: (C)2007,JPO&INPIT |
