| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board where failures are avoided such as getting under the surface of plating, peeling of a film in a process of various metal plating carried out in producing the printed wiring board, and which is excellent in adhesiveness, flexibility, insulation reliability and thermal resistance; and to provide a component where the resin component used for the manufacturing method can be a product of a dry film type contributing to improvement of productivity and reduction of an environmental load. SOLUTION: On an insulating substrate where a metal surface is exposed, a resist film is formed using the resin component containing (A) polyamide acid, (B) a compound having a photopolymerizable group, and (C) a photopolymerization initiator. The formed film is patterned using beams, and the exposed metal surface as the result of removal of the film is plated to manufacture the printed wiring board. COPYRIGHT: (C)2007,JPO&INPIT
|
