| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part having a thinned semiconductor element capable of securing reliability by preventing the damage of the semiconductor element generated in the vicinity of the outer edge, and packing structure of the same. SOLUTION: In an electronic part 1 in which a bump 3 is formed on a plurality of external connection terminals provided on the circuit formation surface of the semiconductor element 2, whose thickness is 150μm or less; a reinforcement 5 is formed with a resin having a higher coefficient of linear expansion than a silicon of a material of the semiconductor element 2, in the range including the edge of the opposite surface of the circuit formation surface. Consequently, under the condition that the bump 3 is connected with the electrode 4a of the circuit substrate 4, it is possible to prevent the damage of the semiconductor element 2 generated in the vicinity of the outer edge, by controlling the bending deformation toward the circuit substrate 4 side generated in the edge of the semiconductor element 2 caused by the difference of the coefficient of linear expansion between the semiconductor element 2 and circuit substrate 4, and reducing the surface stress of the semiconductor element 2 in the outer vicinity of the outermost bump 3. COPYRIGHT: (C)2007,JPO&INPIT
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