SOLDERING METHOD, SOLDERING DEVICE, BONDING METHOD, AND BONDING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a soldering device and a soldering method which involve neither clogging of solder member inside a nozzle nor adhesion of the molten solder member to the periphery of an opening, then, make it possible to reliably eject the solder member. SOLUTION: The soldering method comprises: a holding step of holding a solid solder member at a position spaced apart vertically upwards by a prescribed distance from a substrate; a releasing step of releasing the holding to cause the solder member to fall toward a prescribed position on the substrate; and a heating step of heating the solder member by applying heat radiation to the solder member to impart heat thereto, wherein the solder member existing in air is heated and melted after released from the holding to thereby be deposited at the prescribed position on the substrate. COPYRIGHT: (C)2007,JPO&INPIT