| 摘要 |
PROBLEM TO BE SOLVED: To enhance adhesiveness between a sheet-like substrate of aromatic polyamide film and a thin film layer of copper. SOLUTION: The substrate for flexible printed circuit is produced by laminating a thin film layer of copper and a substrate of aromatic polyamide film through an alloy layer of nickel and chromium wherein the ratio of chromium in the alloy layer is 15-25 wt.%. COPYRIGHT: (C)2007,JPO&INPIT |
