发明名称 SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a tin-zinc-based solder paste easily affected by oxidation and having excellent solderability even under a severe reflow condition including a preheat for a long time at a high temperature of≥160°C. SOLUTION: The solder paste comprises, by weight, 5-20% flux (F) and 80-95% metal powder (M) of the following: The metal powder is an alloy containing flux (M) containing 0.1-20 weight% aluminum coordinate compound and 5-80% carboxylic activator, Sn and Zn. (F) the flux comprises 0.1-20 wt.% aluminum coordinate compound and 5-80% carboxylic activator; (M) the metal power is an alloy comprising Sn and Zn. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305631(A) 申请公布日期 2006.11.09
申请号 JP20060094064 申请日期 2006.03.30
申请人 NOF CORP 发明人 SAITO TAKASHI;NISHIMURA NAOYA;TOKUNAKA TAKEMASA;NAKAZATO KATSUMI
分类号 B23K35/22;B23K35/26;B23K35/363;C22C13/00;H05K3/34 主分类号 B23K35/22
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